74LVC257APW,112
vs
74LVC157ABQ,115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NEXPERIA
NEXPERIA
Part Package Code
TSSOP
QFN
Package Description
TSSOP-16
DHVQFN-16
Pin Count
16
16
Manufacturer Package Code
SOT403-1
SOT763-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
8 Weeks
Date Of Intro
1997-10-27
1998-07-29
Samacsys Manufacturer
Nexperia
Nexperia
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PQCC-N16
JESD-609 Code
e4
e4
Length
5 mm
3.5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVQCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
7 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
2.5 mm
Base Number Matches
2
2
Packing Method
TR, 7 INCH
Compare 74LVC257APW,112 with alternatives
Compare 74LVC157ABQ,115 with alternatives