74LVC257ABQ,115
vs
74LVC257APW,112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
QFN
TSSOP
Package Description
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, QFN-16
4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
Pin Count
16
16
Manufacturer Package Code
SOT763-1
SOT403-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PQCC-N16
R-PDSO-G16
JESD-609 Code
e4
e4
Length
3.5 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC16,.1X.14,20
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TUBE
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
6 ns
6 ns
Propagation Delay (tpd)
7 ns
7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
2.5 mm
4.4 mm
Base Number Matches
2
2
Compare 74LVC257ABQ,115 with alternatives
Compare 74LVC257APW,112 with alternatives