74LVC240ADB,112
vs
MC74LCX240SD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
SSOP2
Package Description
5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20
SSOP,
Pin Count
20
Manufacturer Package Code
SOT339-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
e0
Length
7.2 mm
7.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP20,.3
SSOP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
6.5 ns
Propagation Delay (tpd)
7.5 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.99 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
5.3 mm
5.29 mm
Base Number Matches
2
5
Compare 74LVC240ADB,112 with alternatives
Compare MC74LCX240SD with alternatives