74LVC1G86GM,132
vs
74LVC2G14GV
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SON
|
TSOP
|
| Package Description |
XSON-6
|
PLASTIC, SOT-457, SC-74, TSOP-6
|
| Pin Count |
6
|
6
|
| Manufacturer Package Code |
SOT886
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
6 Weeks
|
|
| Samacsys Manufacturer |
Nexperia
|
NXP
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-G6
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1.45 mm
|
2.9 mm
|
| Logic IC Type |
XOR GATE
|
INVERTER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
2
|
| Number of Inputs |
2
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR, 7 INCH
|
TR
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
13 ns
|
12 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1 mm
|
1.5 mm
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
Yes
|
| Max I(ol) |
|
0.024 A
|
| Package Equivalence Code |
|
TSOP6,.11,37
|
| Schmitt Trigger |
|
YES
|
|
|
|
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