74LVC1G86GF,132
vs
74HCT2G04GW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Part Package Code
SON
SOT-363
Package Description
XSON-6
TSSOP, TSSOP6,.08
Pin Count
6
6
Manufacturer Package Code
SOT891
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Nexperia
Family
LVC/LCX/Z
HCT
JESD-30 Code
S-PDSO-N6
R-PDSO-G6
JESD-609 Code
e3
e3
Length
1 mm
2 mm
Logic IC Type
XOR GATE
INVERTER
Moisture Sensitivity Level
1
1
Number of Functions
1
2
Number of Inputs
2
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
13 ns
29 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
1.65 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.35 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1.25 mm
Base Number Matches
2
2
Pbfree Code
Load Capacitance (CL)
50 pF
Max I(ol)
0.0045 A
Package Equivalence Code
TSSOP6,.08
Packing Method
TR
Prop. Delay@Nom-Sup
22 ns
Schmitt Trigger
NO
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