74LVC1G74DP,125 vs 74LVC1G74DP feature comparison

74LVC1G74DP,125 NXP Semiconductors

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74LVC1G74DP Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code TSSOP
Package Description 3 MM, PLASTIC, SOT-505-2, TSSOP-8
Pin Count 8
Manufacturer Package Code SOT505-2
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code S-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 3 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 175000000 Hz 175000000 Hz
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Bits 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP8,.16 TSSOP8,.16
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 5.9 ns 5.9 ns
Propagation Delay (tpd) 13.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3 mm
fmax-Min 200 MHz
Base Number Matches 2 3

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