74LVC1G32GW,118 vs 74LVC1G32GW-Q100 feature comparison

74LVC1G32GW,118 NXP Semiconductors

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74LVC1G32GW-Q100 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOT
Package Description TSSOP, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Pin Count 5 5
Manufacturer Package Code SOT353-1
Reach Compliance Code unknown unknown
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.05 mm 2.05 mm
Logic IC Type OR GATE OR GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 10.5 ns 10.5 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Rohs Code Yes
HTS Code 8542.39.00.01
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 74LVC1G32GW-Q100 with alternatives