74LVC1G18GW-Q100
vs
MC74LCX257DT
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOT-363
|
|
| Package Description |
TSSOP,
|
TSSOP, TSSOP16,.25
|
| Pin Count |
6
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G16
|
| Length |
2 mm
|
|
| Logic IC Type |
MULTIPLEXER AND DEMUX/DECODER
|
MULTIPLEXER
|
| Number of Functions |
1
|
4
|
| Number of Inputs |
1
|
2
|
| Number of Outputs |
2
|
|
| Number of Terminals |
6
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP6,.08
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
12.5 ns
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.5 mm
|
|
| Base Number Matches |
2
|
5
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.024 A
|
| Power Supplies |
|
3.3 V
|
| Prop. Delay@Nom-Sup |
|
6 ns
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|