74LVC1G18GW,125 vs SN74LVC157ADTG4 feature comparison

74LVC1G18GW,125 NXP Semiconductors

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SN74LVC157ADTG4 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP SOIC
Package Description PLASTIC, SOT363, SC-88, 6 PIN SOP, DIP16,.3
Pin Count 6 16
Manufacturer Package Code SOT363
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G16
JESD-609 Code e3 e4
Length 2 mm 9.9 mm
Logic IC Type MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 4
Number of Inputs 1 2
Number of Outputs 2 1
Number of Terminals 6 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP6,.08 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 12.5 ns 14 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Prop. Delay@Nom-Sup 6.4 ns

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