74LVC1G17GX
vs
SN74LVC1G17MBVREP
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SON
|
SOT-23
|
| Package Description |
0.80 X 0.80 MM, 0.35 MM HEIGHT, PLASTIC, SOT-1226, X2SON-5
|
LSSOP, TSOP5/6,.11,37
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
S-PDSO-N5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
|
| Length |
0.8 mm
|
2.9 mm
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
LSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
14 ns
|
11 ns
|
| Seated Height-Max |
0.35 mm
|
1.45 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.48 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
0.8 mm
|
1.6 mm
|
| Base Number Matches |
2
|
1
|
| Package Equivalence Code |
|
TSOP5/6,.11,37
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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