74LVC1G17GX vs SN74LVC1G17DBV3 feature comparison

74LVC1G17GX NXP Semiconductors

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SN74LVC1G17DBV3 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SON SOT-23
Package Description 0.80 X 0.80 MM, 0.35 MM HEIGHT, PLASTIC, SOT-1226, X2SON-5 PLASTIC, SOT-23, 5 PIN
Pin Count 5 5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code S-PDSO-N5 R-PDSO-G5
JESD-609 Code e3 e6
Length 0.8 mm 2.9 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON LSSOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 14 ns 11 ns
Seated Height-Max 0.35 mm 1.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) TIN BISMUTH
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.48 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 0.8 mm 1.6 mm
Base Number Matches 2 1
Pbfree Code Yes
ECCN Code EAR99
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSOP5/6,.11,37
Packing Method TR
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 5.5 ns
Qualification Status Not Qualified
Schmitt Trigger YES

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