74LVC1G17GW
vs
74LVC1G34GW,125
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e0
e3
Logic IC Type
BUFFER
BUFFER
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
TSSOP
Package Description
1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
Pin Count
5
Manufacturer Package Code
SOT353-1
Family
LVC/LCX/Z
Length
2.05 mm
Moisture Sensitivity Level
1
Number of Functions
1
Number of Inputs
1
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
11 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Time@Peak Reflow Temperature-Max (s)
30
Width
1.25 mm
Compare 74LVC1G34GW,125 with alternatives