74LVC1G17GV-Q100,125 vs 74LVC1G17GV,125 feature comparison

74LVC1G17GV-Q100,125 NXP Semiconductors

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74LVC1G17GV,125 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description PLASTIC, SOT-753, SC-74A, 5 PIN PLASTIC, SC-74A, SOT-753, 5 PIN
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2.9 mm 2.9 mm
Logic IC Type BUFFER BUFFER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 14 ns 14 ns
Screening Level AEC-Q100
Seated Height-Max 1.9 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Width 1.5 mm 1.5 mm
Base Number Matches 2 2
Rohs Code Yes
Part Package Code TSOP
Pin Count 5
Manufacturer Package Code SOT753
Factory Lead Time 4 Weeks
JESD-609 Code e3
Moisture Sensitivity Level 1
Package Equivalence Code TSOP5/6,.11,37
Packing Method TR
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Schmitt Trigger YES
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

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