Findchips: Compare 74LVC1G175GF vs 74LVC1G79GW,165

74LVC1G175GF vs 74LVC1G79GW,165 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NEXPERIA	NXP SEMICONDUCTORS
Package Description	VSON,	TSSOP, TSSOP5/6,.08
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	S-PDSO-N6	R-PDSO-G5
JESD-609 Code	e3	e3
Length	1 mm	2.05 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Terminals	6	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	VSON	TSSOP
Package Shape	SQUARE	RECTANGULAR
Package Style	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260	NOT SPECIFIED
Propagation Delay (tpd)	17 ns	12.5 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	0.5 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN	Tin (Sn)
Terminal Form	NO LEAD	GULL WING
Terminal Pitch	0.35 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	NOT SPECIFIED
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	1 mm	1.25 mm
fmax-Min	200 MHz	200 MHz
Base Number Matches	2	2
Part Package Code		TSSOP
Pin Count		5
Manufacturer Package Code		SOT353-1
Package Equivalence Code		TSSOP5/6,.08
Packing Method		TR
	Logic » FF/Latches	Logic » FF/Latches