74LVC1G157GW,125
vs
MC74LCX258D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
TSSOP
SOIC
Package Description
PLASTIC, SC-88, SOT-363, 6 PIN
SOIC-16
Pin Count
6
16
Manufacturer Package Code
SOT363
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Samacsys Manufacturer
NXP
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G6
R-PDSO-G16
JESD-609 Code
e3
e0
Length
2 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
NOT SPECIFIED
Number of Functions
1
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
6
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
240
Propagation Delay (tpd)
13 ns
8.5 ns
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.25 mm
3.9 mm
Base Number Matches
2
4
Pbfree Code
Output Characteristics
3-STATE
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