74LVC1G157GW,125
vs
935260898118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
SOIC
Package Description
PLASTIC, SC-88, SOT-363, 6 PIN
SOP,
Pin Count
6
16
Manufacturer Package Code
SOT363
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G6
R-PDSO-G16
JESD-609 Code
e3
e4
Length
2 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Number of Functions
1
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
6
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Propagation Delay (tpd)
13 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
1.25 mm
3.9 mm
Base Number Matches
1
1
Pbfree Code
Compare 74LVC1G157GW,125 with alternatives
Compare 935260898118 with alternatives