74LVC1G08GW-Q100,1 vs 935298476125 feature comparison

74LVC1G08GW-Q100,1 NXP Semiconductors

Buy Now Datasheet

935298476125 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1,TSSOP-5 TSSOP,
Pin Count 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant unknown
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.05 mm 2.05 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 10.5 ns 10.5 ns
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01

Compare 74LVC1G08GW-Q100,1 with alternatives