74LVC1G07GW,165
vs
74LVC1G07GW-Q100H
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
TSSOP,
Pin Count
5
5
Manufacturer Package Code
SOT353-1
SOT353-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
Length
2.05 mm
2.05 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
8.4 ns
8.4 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.25 mm
1.25 mm
Base Number Matches
2
2
Screening Level
AEC-Q100
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