74LVC1G07GV-Q100
vs
SN74LVC1G07MDCKREP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NEXPERIA
TEXAS INSTRUMENTS INC
Package Description
TSSOP,
TSSOP, TSSOP5/6,.08
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e4
Length
2.9 mm
2 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP
TSSOP
Package Equivalence Code
TSOP5,.11,37
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
0.004 mA
0.01 mA
Propagation Delay (tpd)
8.4 ns
5.7 ns
Schmitt Trigger
NO
NO
Screening Level
AEC-Q100
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.5 mm
1.25 mm
Base Number Matches
2
1
Pbfree Code
Part Package Code
SOIC
Pin Count
5
ECCN Code
EAR99
Samacsys Manufacturer
Texas Instruments
Load Capacitance (CL)
50 pF
Max I(ol)
0.032 A
Packing Method
TR
Prop. Delay@Nom-Sup
4.7 ns
Qualification Status
Not Qualified
Compare 74LVC1G07GV-Q100 with alternatives
Compare SN74LVC1G07MDCKREP with alternatives