74LVC1G02GF vs 74LVC2G14GW,125 feature comparison

74LVC1G02GF Nexperia

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74LVC2G14GW,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description XSON-6 PLASTIC, SOT-363, SC-88, 6 PIN
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code S-PDSO-N6 R-PDSO-G6
JESD-609 Code e3 e3
Length 1 mm 2 mm
Logic IC Type NOR GATE INVERTER
Moisture Sensitivity Level 1 1
Number of Functions 1 2
Number of Inputs 2 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 10.5 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.35 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.25 mm
Base Number Matches 2 2
Part Package Code TSSOP
Pin Count 6
Manufacturer Package Code SOT363
ECCN Code EAR99
Samacsys Manufacturer NXP
Max I(ol) 0.024 A
Package Equivalence Code TSSOP6,.08
Packing Method TR
Schmitt Trigger YES

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