74LVC1G00GX,125
vs
74LVC1G00GV,125
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
TSOP
Package Description
0.80 X 0.80 MM, 0.35 HEIGHT, SOT-1226, SON-5
PLASTIC, SOT-753, SC-74A, 5 PIN
Pin Count
5
5
Manufacturer Package Code
SOT1226
SOT753
Reach Compliance Code
compliant
compliant
Factory Lead Time
4 Weeks
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
S-PDSO-N5
R-PDSO-G5
JESD-609 Code
e3
e3
Length
0.8 mm
2.9 mm
Logic IC Type
NAND GATE
NAND GATE
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SON
TSSOP
Package Equivalence Code
LCC5(UNSPEC)
TSOP5/6,.11,37
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
10.5 ns
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.35 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.48 mm
0.95 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
0.8 mm
1.5 mm
Base Number Matches
2
2
HTS Code
8542.39.00.01
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