74LVC1G00GW,165
vs
74LVC1G00GW,125
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP, TSSOP5/6,.08
1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
Pin Count
5
5
Manufacturer Package Code
SOT353-1
SOT353-1
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e3
Length
2.05 mm
2.05 mm
Logic IC Type
NAND GATE
NAND GATE
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR, 7 INCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Propagation Delay (tpd)
10.5 ns
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
1.25 mm
1.25 mm
Base Number Matches
1
1
ECCN Code
EAR99
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Nexperia
Compare 74LVC1G00GW,165 with alternatives
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