74LVC16373ADGG,512
vs
IDT74LVC16373APAG8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
RENESAS ELECTRONICS CORP
Part Package Code
TSSOP
Package Description
TSSOP,
TSSOP, TSSOP48,.3,20
Pin Count
48
Manufacturer Package Code
SOT362-1
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e4
e3
Length
12.5 mm
12.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
48
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
5.8 ns
5.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
6.1 mm
6.1 mm
Base Number Matches
2
2
ECCN Code
EAR99
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
TSSOP48,.3,20
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
4.2 ns
Time@Peak Reflow Temperature-Max (s)
30
Compare 74LVC16373ADGG,512 with alternatives
Compare IDT74LVC16373APAG8 with alternatives