74LVC16245AEV/G,51 vs 935270793157 feature comparison

74LVC16245AEV/G,51 NXP Semiconductors

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935270793157 Nexperia

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code BGA
Package Description VFBGA, BGA56,6X10,25 VFBGA,
Pin Count 56
Manufacturer Package Code SOT702-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL WITH DIRECTION CONTROL
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B56 R-PBGA-B56
Length 7 mm 7 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA56,6X10,25 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 5.5 ns 13.8 ns
Qualification Status Not Qualified
Seated Height-Max 0.97 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.5 mm 4.5 mm
Base Number Matches 2 2
Number of Bits 8

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