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74LVC16244ABQ,515 vs 74LVC16244AEV,151 feature comparison

74LVC16244ABQ,515 NXP Semiconductors

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74LVC16244AEV,151 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description VBCC, VFBGA, BGA56,6X10,25
Reach Compliance Code unknown not_compliant
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBCC-B60 R-PBGA-B56
Length 6 mm 7 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 4
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 60 56
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VBCC VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Propagation Delay (tpd) 6 ns 6 ns
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BUTT BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 4 mm 4.5 mm
Base Number Matches 1 1
Rohs Code No
Part Package Code BGA
Pin Count 56
Manufacturer Package Code SOT702-1
HTS Code 8542.39.00.01
Control Type ENABLE LOW
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 2
Package Equivalence Code BGA56,6X10,25
Packing Method TRAY
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 5.5 ns
Qualification Status Not Qualified
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 20
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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