74LVC162373ADGG,51 vs TC74LCX16373AFTELP feature comparison

74LVC162373ADGG,51 NXP Semiconductors

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TC74LCX16373AFTELP Toshiba America Electronic Components

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP,
Pin Count 48 48
Manufacturer Package Code SOT362-1
Reach Compliance Code compliant unknown
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e4 e0
Length 12.5 mm 12.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 48
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE WITH SERIES RESISTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 9 ns 7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 6.1 mm 6.1 mm
Base Number Matches 2 2
Pbfree Code No
Rohs Code No

Compare 74LVC162373ADGG,51 with alternatives

Compare TC74LCX16373AFTELP with alternatives