74LVC157DB
vs
IDT74LVC157AQ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
SSOP,
SSOP, SSOP16,.25
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
6.2 mm
4.9276 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)
9.5 ns
5.9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.7272 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
3.9 mm
Base Number Matches
2
2
Rohs Code
Part Package Code
SOIC
Pin Count
16
JESD-609 Code
e0
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
SSOP16,.25
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
5.2 ns
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
20
Compare 74LVC157DB with alternatives
Compare IDT74LVC157AQ with alternatives