74LVC157APWDH vs 5962-0050901QFA feature comparison

74LVC157APWDH NXP Semiconductors

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5962-0050901QFA Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP DFP
Package Description TSSOP, DFP, FL16,.25
Pin Count 16 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-GDFP-F16
JESD-609 Code e4 e0
Length 5 mm 10.16 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH FLATPACK
Propagation Delay (tpd) 12 ns 5.4 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 1.1 mm 2.03 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING FLAT
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 6.73 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code No
ECCN Code EAR99
Max I(ol) 0.024 A
Number of Bits 2
Output Characteristics 3-STATE
Package Equivalence Code FL16,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 4.6 ns
Screening Level MIL-PRF-38535 Class Q
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 74LVC157APWDH with alternatives

Compare 5962-0050901QFA with alternatives