74LVC157ADB
vs
IDT74LVC157AQ
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
SSOP, SSOP16,.3
|
SSOP, SSOP16,.25
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Equivalence Code |
SSOP16,.3
|
SSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Packing Method |
TUBE
|
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Prop. Delay@Nom-Sup |
6.5 ns
|
5.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| Family |
|
LVC/LCX/Z
|
| JESD-609 Code |
|
e0
|
| Length |
|
4.9276 mm
|
| Number of Outputs |
|
1
|
| Output Polarity |
|
TRUE
|
| Propagation Delay (tpd) |
|
5.9 ns
|
| Seated Height-Max |
|
1.7272 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
3.9 mm
|
|
|
|
Compare IDT74LVC157AQ with alternatives