74LVC157AD-T
vs
SN74LVC257APWRE4
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NEXPERIA
|
TEXAS INSTRUMENTS INC
|
Package Description |
,
|
TSSOP, TSSOP16,.25
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
JESD-609 Code |
e4
|
e4
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
16
|
Samacsys Manufacturer |
|
Texas Instruments
|
Family |
|
LVC/LCX/Z
|
JESD-30 Code |
|
R-PDSO-G16
|
Length |
|
5 mm
|
Max I(ol) |
|
0.024 A
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Outputs |
|
1
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
|
3-STATE
|
Output Polarity |
|
TRUE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Equivalence Code |
|
TSSOP16,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
4.6 ns
|
Propagation Delay (tpd) |
|
13.5 ns
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Width |
|
4.4 mm
|
|
|
|
Compare 74LVC157AD-T with alternatives
Compare SN74LVC257APWRE4 with alternatives