74LVC157AD-T
vs
74LVC157AD,112
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
3.90 MM, PLASTIC, MS-012, SOT-109-1, SO-16
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
JESD-609 Code |
e4
|
e4
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOP
|
Pin Count |
|
16
|
Manufacturer Package Code |
|
SOT109-1
|
Factory Lead Time |
|
4 Weeks
|
Family |
|
LVC/LCX/Z
|
JESD-30 Code |
|
R-PDSO-G16
|
Length |
|
9.9 mm
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.024 A
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Outputs |
|
1
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Polarity |
|
TRUE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP16,.25
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Packing Method |
|
TUBE
|
Prop. Delay@Nom-Sup |
|
6.5 ns
|
Propagation Delay (tpd) |
|
7.5 ns
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
|
2.7 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
DUAL
|
Width |
|
3.9 mm
|
|
|
|
Compare 74LVC157AD-T with alternatives
Compare 74LVC157AD,112 with alternatives