74LVC157ABQ,115 vs MC74LCX158D feature comparison

74LVC157ABQ,115 NXP Semiconductors

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MC74LCX158D Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code QFN SOIC
Package Description 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16 SOP,
Pin Count 16 16
Manufacturer Package Code SOT763-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PQCC-N16 R-PDSO-G16
JESD-609 Code e4
Length 3.5 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Equivalence Code LCC16,.1X.14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6.5 ns
Propagation Delay (tpd) 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2.7 V
Supply Voltage-Nom (Vsup) 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 2.5 mm 3.9 mm
Base Number Matches 2 4

Compare 74LVC157ABQ,115 with alternatives

Compare MC74LCX158D with alternatives