74LVC153DB vs SN74LVC157ADR feature comparison

74LVC153DB NXP Semiconductors

Buy Now Datasheet

SN74LVC157ADR Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description SSOP, GREEN, PLASTIC, MS-012AC, SOIC-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 6.2 mm 9.9 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 16
ECCN Code EAR99
Date Of Intro 1993-04-01
Samacsys Manufacturer Texas Instruments
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Bits 2
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 6.4 ns
Propagation Delay (tpd) 14 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 74LVC153DB with alternatives

Compare SN74LVC157ADR with alternatives