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74LVC139PWDH vs 74LVC139PW,118 feature comparison

74LVC139PWDH NXP Semiconductors

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74LVC139PW,118 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSSOP, 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 5 mm
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 7.5 ns 8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Rohs Code Yes
Part Package Code TSSOP
Pin Count 16
Manufacturer Package Code SOT403-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 100 mA
Prop. Delay@Nom-Sup 7 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Logic » Decoder/Drivers
Logic » Decoder/Drivers

Compare 74LVC139PWDH with alternatives

Compare 74LVC139PW,118 with alternatives