74LVC139BQ,115
vs
AM25LS2536XM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NEXPERIA
ADVANCED MICRO DEVICES INC
Part Package Code
QFN
DIE
Package Description
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16
DIE,
Pin Count
16
20
Manufacturer Package Code
SOT763-1
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
8 Weeks
Date Of Intro
1998-04-28
Samacsys Manufacturer
Nexperia
Family
LVC/LCX/Z
LS
Input Conditioning
STANDARD
REGISTERED
JESD-30 Code
R-PQCC-N16
R-XUUC-N20
JESD-609 Code
e4
Length
3.5 mm
Logic IC Type
2-LINE TO 4-LINE DECODER
3-LINE TO 8-LINE DECODER
Moisture Sensitivity Level
1
Number of Functions
2
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
INVERTED
CONFIGURABLE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVQCCN
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
UNCASED CHIP
Packing Method
TR, 7 INCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
11.3 ns
42 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
1.2 V
4.5 V
Supply Voltage-Nom (Vsup)
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD SILVER
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
QUAD
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
Base Number Matches
2
1
Load Capacitance (CL)
45 pF
Output Characteristics
3-STATE
Package Equivalence Code
DIE OR CHIP
Power Supply Current-Max (ICC)
56 mA
Compare 74LVC139BQ,115 with alternatives
Compare AM25LS2536XM with alternatives