Findchips: Compare 74LVC132ABQ,115 vs 74HCT32BQ

74LVC132ABQ,115 vs 74HCT32BQ feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	PHILIPS SEMICONDUCTORS
Part Package Code	QFN
Package Description	HVQCCN, LCC14,.1X.12,20	QCCN, LCC14,.1X.12,20
Pin Count	14
Manufacturer Package Code	SOT762-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z
JESD-30 Code	R-PQCC-N14	R-PQCC-N14
JESD-609 Code	e4
Length	3 mm
Logic IC Type	NAND GATE	OR GATE
Max I(ol)	0.024 A	0.004 A
Moisture Sensitivity Level	1	1
Number of Functions	4
Number of Inputs	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HVQCCN	QCCN
Package Equivalence Code	LCC14,.1X.12,20	LCC14,.1X.12,20
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER
Packing Method	TR	TR
Peak Reflow Temperature (Cel)	260	260
Prop. Delay@Nom-Sup	8 ns	36 ns
Propagation Delay (tpd)	16 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	NO
Seated Height-Max	1 mm
Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	1.2 V
Supply Voltage-Nom (Vsup)	1.8 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	QUAD	QUAD
Time@Peak Reflow Temperature-Max (s)	30
Width	2.5 mm
Base Number Matches	2	3
Load Capacitance (CL)		50 pF
	Logic » Gates	Logic » Gates