74LVC126APW,118
vs
IDT74LVC125APG
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TSSOP
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
TSSOP, TSSOP14,.25
Pin Count
14
14
Manufacturer Package Code
SOT402-1
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Control Type
ENABLE HIGH
ENABLE LOW
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e0
Length
5 mm
5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
1
Number of Bits
1
1
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP14,.25
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
240
Prop. Delay@Nom-Sup
6 ns
4.8 ns
Propagation Delay (tpd)
13 ns
6.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
4.4 mm
Base Number Matches
2
1
Compare 74LVC126APW,118 with alternatives
Compare IDT74LVC125APG with alternatives