74LVC11DB,118
vs
IDT74LVC11ADC
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SSOP1
SOIC
Package Description
5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14
SOP, SOP14,.25
Pin Count
14
14
Manufacturer Package Code
SOT337-1
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e0
Length
6.2 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
3
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Equivalence Code
SSOP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
7.2 ns
6.2 ns
Propagation Delay (tpd)
7 ns
7 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
2 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
2.3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
5.3 mm
3.9 mm
Base Number Matches
1
4
Output Characteristics
3-STATE
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