74LVC11BQ
vs
74HCT00BQ,115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
QCCN, LCC14,.1X.12,20
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PQCC-N14
R-PQCC-N14
JESD-609 Code
e4
e4
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
NAND GATE
Max I(ol)
0.024 A
0.004 A
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCN
HVQCCN
Package Equivalence Code
LCC14,.1X.12,20
LCC14,.1X.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Prop. Delay@Nom-Sup
6.2 ns
29 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Base Number Matches
3
2
Part Package Code
QFN
Pin Count
14
Manufacturer Package Code
SOT762-1
Factory Lead Time
4 Weeks
Family
HCT
Length
3 mm
Moisture Sensitivity Level
1
Number of Functions
4
Number of Inputs
2
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
29 ns
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
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