74LVC07AD-T
vs
74LCX07MTR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
|
SOP, SOP14,.25
|
Pin Count |
14
|
14
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
e4
|
Length |
8.65 mm
|
8.65 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
6
|
6
|
Number of Inputs |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
6.5 ns
|
7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
STMicroelectronics
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.024 A
|
Package Equivalence Code |
|
SOP14,.25
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
5.2 ns
|
Schmitt Trigger |
|
NO
|
|
|
|
Compare 74LVC07AD-T with alternatives
Compare 74LCX07MTR with alternatives