74LV595N
vs
74AHC595BQ,115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP, DIP16,.3
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T16
R-PQCC-N16
Max Frequency@Nom-Sup
20000000 Hz
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
HVQCCN
Package Equivalence Code
DIP16,.3
LCC16,.1X.14,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
QUAD
Base Number Matches
2
2
Part Package Code
QFN
Pin Count
16
Manufacturer Package Code
SOT763-1
Count Direction
RIGHT
Family
AHC/VHC/H/U/V
JESD-609 Code
e4
Length
3.5 mm
Logic IC Type
SERIAL IN PARALLEL OUT
Moisture Sensitivity Level
1
Output Polarity
TRUE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
20.1 ns
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2 V
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
Width
2.5 mm
fmax-Min
90 MHz
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