74LV574D,118 vs HD74LV574ARP feature comparison

74LV574D,118 NXP Semiconductors

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HD74LV574ARP Renesas Electronics Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code SOP
Package Description 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 SOP,
Pin Count 20
Manufacturer Package Code SOT163-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BROADSIDE VERSION OF 374
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25 ns
Propagation Delay (tpd) 43 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE
Width 7.5 mm 7.5 mm
Base Number Matches 1 2

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Compare HD74LV574ARP with alternatives