74LV393D,112 vs MC14040BDR2 feature comparison

74LV393D,112 NXP Semiconductors

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MC14040BDR2 Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SOIC
Package Description PLASTIC, SOT-108, SO-14 SOP, SOP16,.25
Pin Count 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Count Direction UP UP
Family LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G16
JESD-609 Code e4 e0
Length 8.65 mm
Load Capacitance (CL) 50 pF
Load/Preset Input NO YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Max Frequency@Nom-Sup 20000000 Hz 1500000 Hz
Max I(ol) 0.006 A
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Moisture Sensitivity Level 1
Number of Bits 4
Number of Functions 2 1
Number of Terminals 14 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method BULK TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 35 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type NEGATIVE EDGE
Width 3.9 mm
fmax-Min 20 MHz
Base Number Matches 2 4
Power Supplies 5/15 V

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