74LV377N,112 vs 74LV377PW,112 feature comparison

74LV377N,112 NXP Semiconductors

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74LV377PW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP TSSOP2
Package Description PLASTIC, DIP-20 PLASTIC, TSSOP-20
Pin Count 20 20
Manufacturer Package Code SOT146-1 SOT360-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 4 Weeks
Additional Feature WITH HOLD MODE WITH HOLD MODE
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 Code R-PDIP-T20 R-PDSO-G20
JESD-609 Code e4 e4
Length 26.73 mm 6.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz 20000000 Hz
Max I(ol) 0.008 A 0.008 A
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP20,.3 TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 36 ns 36 ns
Propagation Delay (tpd) 36 ns 36 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1 V 1 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 4.4 mm
fmax-Min 20 MHz 20 MHz
Base Number Matches 1 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare 74LV377N,112 with alternatives

Compare 74LV377PW,112 with alternatives