74LV132DB
vs
74LV132DB,118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
SSOP, SSOP14,.3
5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2017-02-01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e4
Length
6.2 mm
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.006 A
0.006 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP14,.3
SSOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
25 ns
25 ns
Propagation Delay (tpd)
43 ns
43 ns
Schmitt Trigger
YES
YES
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
5.3 mm
5.3 mm
Base Number Matches
3
2
Part Package Code
SSOP1
Pin Count
14
Manufacturer Package Code
SOT337-1
Factory Lead Time
4 Weeks
Packing Method
TR
Qualification Status
Not Qualified
Compare 74LV132DB with alternatives
Compare 74LV132DB,118 with alternatives