74LV04PW
vs
74LV04DB,112
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TSSOP
SSOP1
Package Description
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e4
Length
5 mm
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.006 A
0.006 A
Moisture Sensitivity Level
1
1
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SSOP
Package Equivalence Code
TSSOP14,.25
SSOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
15 ns
15 ns
Propagation Delay (tpd)
25 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.1 mm
2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
5.3 mm
Base Number Matches
3
2
Manufacturer Package Code
SOT337-1
Packing Method
TUBE
Compare 74LV04PW with alternatives
Compare 74LV04DB,112 with alternatives