74LS181N vs HD74LS181P feature comparison

74LS181N NXP Semiconductors

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HD74LS181P Hitachi Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP HITACHI LTD
Package Description , DIP, DIP24,.6
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS
Family LS LS
JESD-30 Code R-PDIP-T24 R-PDIP-T24
Logic IC Type ARITHMETIC LOGIC UNIT ARITHMETIC LOGIC UNIT
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 37 mA 37 mA
Propagation Delay (tpd) 62 ns 41 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
Rohs Code No
Part Package Code DIP
Pin Count 24
JESD-609 Code e0
Length 30.4 mm
Load Capacitance (CL) 15 pF
Package Equivalence Code DIP24,.6
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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