74LS112F
vs
N74LS112N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SIGNETICS CORP
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Load Capacitance (CL)
15 pF
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
8 mA
8 mA
Propagation Delay (tpd)
30 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
fmax-Min
30 MHz
Base Number Matches
3
4
Rohs Code
JESD-609 Code
e0
Max Frequency@Nom-Sup
30000000 Hz
Max I(ol)
0.008 A
Package Equivalence Code
DIP16,.3
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare 74LS112F with alternatives