74LS10F
vs
N74LS10N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SIGNETICS CORP
NXP SEMICONDUCTORS
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Load Capacitance (CL)
15 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
3.3 mA
6.6 mA
Propagation Delay (tpd)
15 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
3
4
JESD-609 Code
e0
Max I(ol)
0.008 A
Output Characteristics
TOTEM POLE
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
20 ns
Schmitt Trigger
NO
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare 74LS10F with alternatives
Compare N74LS10N with alternatives