74LCX573WMX vs TC74LCX573FWELP feature comparison

74LCX573WMX onsemi

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TC74LCX573FWELP Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ONSEMI TOSHIBA CORP
Package Description SOIC-20 SOP,
Manufacturer Package Code 751BJ
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e3
Length 12.801 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 8 ns
Propagation Delay (tpd) 10.5 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.642 mm 2.7 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.493 mm 7.5 mm
Base Number Matches 4 1
Part Package Code SOIC
Pin Count 20

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